Assembly Process Innovation Engineer

Responsibilities： - GTI-PI-API (Global Technology Innovation- PackagingInnovation-Assembly Process Innovation) is a research and developmentengineering team responsible for the design, development, execution, and/orimplementation of packaging product, structures, or assembly processtechnologies. Investigates the feasibility of applying scientific andengineering principles and emerging technologies and capabilities to potentialsemiconductor packaging and assembly process offerings. Then, effectivelydevelops or designs the implementation of these into manufacturing. Maintainssubstantial knowledge of state-of-the-art principles and theories and maycontribute to scientific literature and conferences. May also participate indevelopment of patent applications. Maintains an understanding of thesemiconductor market and effectively translates market requirements topackaging. - API Tianjin department is focusing on IC package/processdevelopment. Major projects include development work on leadframe based andlaminate based packages. Qualifications： - Master and PhD are preferred. Orbachelor degree with at least 1 year experience in packaging industry. - Majoron: Metallic Materials Engineering; Polymer Materials Engineering; MechanicalEngineering and Automation. - At least CET-4 degree or equivalent English leveland CET-6 is preferred. - Intention and capability to work in across-functional/global team environment. - Independent R&D capability.Preference: - Experience in material analysis: EDX/SEM, AES, SIMS etc. -Excellent English communication skill. - Project management and team managementexperience in industry or in university social activities. - Statistic analysisknowledge, 6Sigma GB/BB is preferred.