Graduate_SoC Physical Design Engineer
电子信息类·物理学类
使用简历深度优化功能,快速提升简历质量
职位介绍
招聘部门:ASIC Service BU
【职位职责】
1. Physical Design Implementation: Participate in the RTL-to-GDSII physical design flow for advanced SoC/IP designs, including floorplanning, power planning, placement, Clock Tree Synthesis (CTS), routing, and design optimization.
2. 数字后端物理实现: 参与先进工艺 SoC/IP 的 RTL-to-GDSII 数字后端设计流程,包括 Floorplan、电源规划(Power Planning)、布局(Placement)、时钟树综合(CTS)、布线(Routing)及设计优化。
3. Timing Analysis & Closure: Perform Static Timing Analysis (STA), analyze setup/hold timing violations, and work with design teams to achieve timing closure across different operating modes and PVT corners.
4. 时序分析与收敛: 参与静态时序分析(STA),分析 Setup/Hold 等时序违例,并配合设计团队完成不同工作模式及 PVT Corner 下的时序收敛。
5. PPA Optimization: Analyze and optimize Performance, Power, and Area (PPA) throughout the physical design flow, including placement, clock, timing, congestion, and power-related optimization.
6. PPA 优化: 在物理设计过程中分析并优化芯片性能、功耗和面积(Performance, Power and Area),参与 Placement、Clock、Timing、Congestion 及 Power 等相关优化工作。
7. Physical Verification & Signoff: Participate in physical design signoff activities, including DRC/LVS, parasitic extraction, signal integrity, and EM/IR analysis, to ensure designs meet timing, power, reliability, and foundry requirements.
8. 物理验证与 Signoff: 参与 DRC/LVS、寄生参数提取(RC Extraction)、信号完整性(SI)及 EM/IR 等物理验证与 Signoff 工作,确保设计满足时序、功耗、可靠性及 Foundry 设计规则要求。
9. Flow Automation & Cross-Functional Collaboration: Develop scripts and automation utilities to improve design efficiency, and collaborate with RTL, STA, DFT, CAD, verification, and other teams to debug design issues and support successful chip tape-out.
10. 流程自动化与跨团队协作: 编写脚本及自动化工具提升设计效率,并与 RTL、STA、DFT、CAD、验证等团队协作,分析和解决设计问题,支持芯片顺利完成 Tape-out。
【任职要求】
1. Master’s degree or above in Microelectronics, Integrated Circuit Design, Electronic Engineering, Computer Engineering, Computer Science, or related fields).
2. 微电子、集成电路设计、电子工程、计算机工程、计算机科学或相关专业,硕士及以上学历。
3. Solid understanding of digital IC fundamentals
【学历要求】
硕士及以上
【硬性专业要求】
微电子相关专业、集成电路设计相关专业、电子工程相关专业、计算机工程相关专业、计算机科学相关专业
所属批次:安谋科技(中国)有限公司 2027届校园招聘简章企业职位库在招档案→

